Team & Roadmap

Project Roadmap & Team Requirements

v3.2.0 frozen. ~500K lines source code across 9 repos, 24% production ready. Hardware integration started, certification targeted for 2026 H2.

v3.2.0Current Version
62%Code Written
45%Functional
24%Prod Ready
~500KSource Code
9Repos
Current Status
Progress Breakdown — v3.2.0
62% CODE
38% REMAINING

Backend API

80% complete · 116K LOC

CQRS/DDD architecture, 287 endpoints, OCPP gateway, JWT/RBAC fully working. Missing: payment integration, OCPI federation, load test optimization.

ADVANCED

EVSE Firmware

65% complete · 269K C/H

14 modules, protocol codecs, cryptography working. Missing: HAL hardware integration, real HW testing, power management fine-tuning, MID certification.

MODERATE

Hodet Firmware

55% complete · 30K LOC

12 modules, TPM integration, OTA update. Missing: full CRA compliance, PQC hardware test, network security fine-tuning.

MODERATE

Dashboard & UI

70% complete · ~55K TS/TSX

4 React apps, 326 tests, accessibility. Missing: real-time WebSocket dashboard, advanced charting, mobile-first optimization, i18n expansion.

GOOD

Yocto BSP

50% complete · ~15K

32 recipes, security layers, QEMU test. Missing: i.MX8M real HW boot, RAUC OTA production pipeline, dm-verity signing.

MODERATE

Security & PQC

45% complete

PQC algorithms, HSM/TPM integration, crypto working. Missing: pentest, CVE 0-day scanning, CRA self-assessment, FIPS 140-2 validation.

CRITICAL
Roadmap
Road to Production — Honest Timeline

Phase 1 — Foundation DONE

2024 Q1-Q2 · 6 months

Architecture design, CQRS/DDD setup, firmware skeleton, Yocto BSP foundation, PQC research. v1.0 → v2.0.

Phase 2 — Core Development DONE

2024 Q3-Q4 · 6 months

Backend API completion, firmware modules, OCPP gateway, dashboard MVP, test infrastructure. v2.0 → v3.0.

Phase 3 — Integration & Testing DONE

2025 · 12 months

Full component integration, ~7,300 tests, security audit, CRA framework development, v3.2.0 frozen.

Phase 4 — Hardware Bring-up ACTIVE

2026 Q1-Q2 · 6 months

i.MX8M Plus real HW testing, STM32 integration, ATECC608B validation, QEMU→real board transition, power analysis.

Phase 5 — Certification & Compliance PLANNED

2026 Q3-Q4 · 6 months

CE certification, CRA compliance finalization, MID/Eichrecht, pentest, IEC 61851 test, ISO 15118 conformance, EMC pre-compliance.

Phase 6 — Pilot & Production TARGET

2027 Q1-Q2 · Launch

Field pilot testing, production line setup, first batch manufacturing, monitoring infrastructure, customer pilot program.

Milestones
Critical Milestones
M1: Hardware Prototype
2026 Q2

First hardware prototype PCB ready

  • i.MX8M + STM32 dual-processor board
  • HSM/TPM soldering & verification
  • Yocto BSP boot & firmware flash
M2: OCPP Certification
2026 Q3

OCPP 2.0.1 conformance test passed

  • OCA test tool verification
  • Security Profile 3 support
  • ISO 15118 Plug & Charge
M3: CRA Compliance
2026 Q4

EU Cyber Resilience Act full compliance

  • SBOM (CycloneDX) delivery
  • Vulnerability management process
  • 5-year security update commitment
M4: CE Certification
2026 Q4

CE marking & type approval

  • IEC 61851-1 charging safety
  • EMC compliance (EN 61000)
  • LVD (EN 62368-1) safety
M5: Pilot Program
2027 Q1

10-station field pilot test

  • 3-month field durability test
  • Real customer feedback
  • OTA update verification
M6: Mass Production
2027 Q2

Factory production line & first batch

  • 1,000 unit initial batch
  • Supply chain optimization
  • Sales & distribution channels
Team
Required Team to Reach Production
Embedded SW Engineer
3

C/C++ · STM32/i.MX8M · RTOS · HAL · power electronics. Firmware module development, HW integration.

CRITICAL
Backend SW Engineer
2

Python · FastAPI · PostgreSQL · Redis · OCPP. API development, performance optimization, integration testing.

HIGH
Security Engineer
2

PQC · HSM/TPM · CRA · pentest · crypto. Security architecture, penetration testing, certification prep.

CRITICAL
Frontend Developer
1

React · TypeScript · WebSocket · Grafana. Dashboard development, real-time visualization, mobile optimization.

MEDIUM
DevOps / BSP Engineer
1

Yocto · Docker · CI/CD · RAUC OTA · dm-verity. BSP development, deployment pipeline, monitoring infrastructure.

HIGH
QA / Test Engineer
1

Automated test · HW test · IEC/ISO conformance. Test strategy, CI quality gate, certification testing.

MEDIUM
Hardware Engineer
1

PCB design · power electronics · EMC · thermal. Hardware prototype, manufacturing optimization, certification.

HIGH
Project Manager
1

Agile · technical management · stakeholder communication · certification coordination. Sprint planning, resource management.

MEDIUM
Total Required Team
12
Full-time engineers · 18-month timeline · estimated budget: €1.2M/year
Risks
Risk Analysis & Mitigation

Hardware Delays

HIGH

Chip supply chain issues, PCB prototype delays. Mitigation: alternate supplier list, early ordering, QEMU simulation continuity.

Certification Timeline

MEDIUM

CE, MID, ISO cert processes can take 3-6 months. Mitigation: early pre-compliance testing, certification consultant.

Team Shortage

HIGH

Embedded & security engineers hard to find. Mitigation: remote work, university partnerships, early competency-based hiring.

Regulatory Changes

LOW

CRA or IEC standard updates. Mitigation: modular architecture, compliance layer abstraction, regular standards monitoring.